Flux Action Based on Electrical Conductivities of Molten Fluxes for Soldering (Report 1)

概要

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This investigation was made to know the effect of complex ion and compound present in a flux aqueous solution on the spreading of solder. The used flux solution is ZnCl2-NH4Cl system, and the equivalent conductances were measured at various concentrations and mixing ratios for the mixing system. Results show that the equivalent conductance of the solution with 5.77N concentration deviates to negative side from the mixing rule at 50°C, probably because of the formation of the complex compound showed by the following equation; [ZnCl4]2- +3NH4++Cl- (NH4)3[ZnCl4] Cl On the other hand, the spreading test of a low melting point solder on copper base plate was made by using the 5N solution at 60°C. This experimental result shows that the formed complex compound indirectly affects to the spreading of the solder. Namely, though the activity of Cl- in the solution decreases with an increasing of the compound, the spreading is found when the aC1- and pH of the solution satisfy the relation that is shown by the following equation; log aC1-=-4.65+pH (where 1<pH<4.4) and if the pH is constant, the spread area is about equal at each mixing ratio.
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