ばね用Cu-Ni-Sn合金の特性
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概要
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This paper describes the investigation carried out on the Cu-Ni-Sn alloy developed as the materials for lead frames, springs and connectors, and on the solder-laminated Cu-Ni-Sn alloy prepared for improving the corrosion resistance and soldering capacity (for eliminating the preliminary soldering step) of the Cu-Ni-Sn alloy.The results showed that since the tensile strength and spring limit value of the Cu-Ni-Sn alloy were 500MPa and 450MPa, respectively, it can be used as a medium-conductivity (50% IACS) lead frame with better heat resistance and workability as well as a spring material.The adherence and corrosion resistance of the solder of the solder-laminated Cu-Ni-Sn alloy were very good, and its mechanical strength was the same as that of the Cu-Ni-Sn alloy itself.
- 日本ばね学会の論文
日本ばね学会 | 論文
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