Effects of n-alkylamines on corrosion of copper with sulfuric acid/hydrogen peroxide etching solutions.

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The corrosion of copper in sulfuric acid/hydrogen peroxide etching solutions with n-alkylamines was studied by means of weight loss and polarization techniques at various flow rates of the etching solution.The addition of n-butylamine to the basic etching solution (2mol H2SO4+2mol H2O2+1kg H2O) led to both the polarization of the anodic partial reaction and the depolarization of the cathodic partial reaction, so that the corrosion potential shifted toward the positive potential. Methylamine acted as a corrosion inhibitor. Ethylamine, n-propylamine and n-butylamine changed from corrosion inhibitors to corrsion accelerators with an increase in the flow rate of the etching solution. Increases in the concentration of amines other than methylamine raised the effects of both corrosion inhibition at lower flow rates and corrosion acceleration at higher flow rates. Increases in the corrosion rate gave rise to increases in the etch factor.Amines added to corrosion solutions had several benefits; 1) they retarded the decomposition of hydrogen peroxide; 2) they shortened the etching time due to increases in the corrosion rate; 3) they inceased the etch factor; and 4) they inhibited the corrosion of the metal surface being etched.
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