Analysis of electroless copper plating baths by isotachophoresis.
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概要
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Simultaneous analysis of EDTA (complexing agent), Cu-EDTA (copper complex of EDTA) and formate (oxidation product of formaldehyde) contained in copper plating baths used in the full-additive process was carried out within 20 minutes, by isotachophoresis using hydrochloric acid and histidine (pH 6.0) as the leading electrolyte and sodium caproate as the terminal electrolyte.Free copper ions were not detected.Gas chromatography showed that the formaldehyde decreased in proportion to the increase of formate. This shows that isotachophoresis can be used to monitor the concentration of the reducing agent (formaldehyde) in a copper plating bath.Several amines and amino acids added to the copper plating bath were also determined.
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