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The behavior of Cu (I) in a high-speed electroless copper plating bath was investigated by measuring absorption spectrum of Cu (I) -biquinoline complex. It was found that Cu (I) was formed in Rochelle salt bath regardless of the presence of formaldehyde. The concentration of Cu (I) in this type of plating bath increased with an increase of the Tartrate/Cu (II) molar ratio, leading to the spontaneous decomposition of the bath. Although high-speed electroless copper deposition at higher temperature with satisfactory deposition rate and bath stability was attained by Rochelle salt bath containing the selected additives, ductility of the deposit was far from satisfaction. In EDTA bath, Cu (I) was not detected regardless of the presence of additives. By the combined use of 2, 2′-dipyridyl (10mg/l) with other additives in this bath, high-speed copper deposition was attained with a satisfactory deposition rate, bath stability and high ductility of the deposit. Higher ductility of the deposit and bath stability attained by the EDTA bath compared to Rochelle salt bath was supposed to be due to the fact that no Cu (I) was formed during the deposition reaction in the former type of plating bath. The formation of Cu (I) in different types of plating bath using various complexing agents for Cu (II) was also investigated. Of the 10 types of the bath tested, Cu (I) was detected in 7 baths except in EDTA, DTPA and Quadrol baths. By using the same additives which were proved to be effective in EDTA bath into DTPA and Quadrol baths, high-speed copper deposition was attained with the satisfactory quality of the deposit.
- 社団法人 表面技術協会の論文
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