Studies on Adsorption Behavior of Addition Agents used for Copper Electroplating by Measuring Differential Capacity of Electrical Double Layer

スポンサーリンク

概要

• 論文の詳細を見る

• The adsorption behavior of addition agents used for electroplating of copper in acid copper sulfate bath was studied on a dropping mercury electrode relating to their concentration and electrode potential by measuring differential capacity of electrical double layer.The potentials were measured by using Hg/Hg2SO4, 1N H2SO4 as a reference electrode. The zero charge potential of Hg electrode in 1N H2SO4 was estimated as zero volt for further discussion.By the addition of thiourea (TU) or acetyl thiourea to 1N H2SO4, new peaks of capacity appeared at +0.6V and +0.75V.When phenylthiourea was added to the same solution, the maximum of differential capacity at +0.15V appeared to decrease considerably.These effects could be explained by the adsorption of TU and its derivatives on the surface of mercury electrode at rather positive potential.Sodium β-naphthalene sulfonate (NS) and trisodium 1, 3, 5-naphthalene sulfonate had the similar effects on capacity-potential (C-E) curve, in which a minimum of differential capacity was observed at +0.3V and a maximum of that at -0.3V in the both agents. However, disodium 1, 5-naphthalene sulfonate gave a minimum at +0.3V and a maximum at 0V.When TU and NS were concurrently added to 1N H2SO4, C-E curve was found as the sum of the each individual curve of each single addition agent. Therefore, it was concluded that there was no specific interaction between the adsorptions of TU and NS.When benzotriazole was added to 1N H2SO4, the maximum at +0.15V in C-E curve remarkably decreased. By the addition of polyacrylamide, the differential capacity of electrical double layer noticeably increased at E>+0.55V and the maximum at +0.15V decreased.It was found that methyl-isothiourea, glycine, and l-cystine had no effects on C-E curve in 1N H2SO4.

• 社団法人 表面技術協会の論文

社団法人 表面技術協会 | 論文

• イオンプレーティング法による厚膜化の現状とピストンリングへの応用
• 自動車用エンジン部品の表面技術と環境対策
• プリント配線基板で発生するイオンマイグレーションと信頼性解析
• イオン交換体の設計と輸送現象
• 半導体膜の低温成長

もっと見る

スポンサーリンク