Tensile Properties and Viscoelastic Model of a Polyimide Film

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概要

• 論文の詳細を見る

• This paper presents tensile properties of a polyimide thin film used in electronic devices. Tensile tests were performed to determine Young's modulus, proportional limit, yield stress, ultimate tensile strength and elongation of the polyimide film. Effects of strain rate and temperature on the tensile properties were discussed. There was a little effect of strain rate on Young's modulus but proportional limit, yield stress and ultimate tensile strength increased with increasing strain rate. Only elongation decreased with strain rate. Young's modulus, proportional limit, yield stress and ultimate tensile strength decreased with increasing temperature, but elongation increased. Applicability of a viscoelastic model for describing the stress-strain curves of the polyimide film was discussed.

• 一般社団法人 日本機械学会の論文

著者

• SAKANE Masao

  Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University

• NAGASAWA Tadashi

  Kyocera SLC Technologies Corporation

• KOBAYASHI Kaoru

  Kyocera SLC Technologies Corporation

• ZHANG Shengde

  Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University

• MORI Syuhei

  Department of Mechanical Engineering, Graduate School, Ritsumeikan University

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• Tensile Properties and Viscoelastic Model of a Polyimide Film

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