Thermal and competition aware mapping for 3D network-on-chip

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概要

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• Three-dimensional network-on-chip (3D NoC), which combines NoC with 3D IC technology, offers several prominent advantages, including reduced overall interconnection length and design flexibility. However, it suffers from the high chip temperature problem. In the ciliated 3D Mesh architecture, the competition for the port of the router is fierce. A new temperature and network competition-aware mapping algorithm is proposed to reduce the peak temperature and decrease the network competition. The new algorithm can realize the multi-objective mapping and ensure a lower time complexity. Simulation results show that our method achieves an appropriate balance between peak temperature and network competition.

著者

• Gu Huaxi

  State Key Lab Of Isn Xidian University

• Yang Yintang

  Institute of Microelectronics, Xidian University

• Wang Kun

  School of Computer Science, Xidian University

• Zhang Bixia

  State Key Laboratory of ISN, Xidian University

• Wang Zhengyu

  State Key Laboratory of ISN, Xidian University

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