無電解銅めっき液の分極挙動と析出物の電子線解析

概要

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Polarization behavior of an electroless copper plating solution containing EDTA as a complexing agent has been studied and the composition, surface appearance and cross section of the deposits have been investigated by electron diffraction analysis At 70°C, polarization behavior was explicable by the mixed potential theory at low concentrations of HCHO and copper complex ion CuY2- was found to be directly reduced to metallic copper The electron diffraction analysis of the deposit showed the deposition of Cu alone At 70°C and high concentrations of HCHO, however, the additivity of the polarization curves did not holdA two-step reduction of CuY2- took place, resulting in the codposition of Cu2O This is explained by the hypothesis that the alcoholate ion from the HCHO was adsorbed on the working electrode. The results obtained at 70°C and high concentrations of HCHO, were found to hold true also at 30°C The codposition of Cu2O influenced the surface appearance and cross section of the deposits
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