無電解銅めっきにおけるフェナントロリン添加剤の作用機構

概要

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An electroless copper plating method using EDTA (ethylenediaminetetraacetic acid) as a complexing agent and HCHO as a reducing agent has been studied. Additives used were 2, 9-dimethyl-1, 10-phenanthroline (2, 9-dmph) and 5, 6-dimethyl-1, 10-phenanthroline (5, 6-dmph).The working mechanism of 2, 9-dmph, which had a cuproine functional group, was the reiteration of the following three steps:1. adsorption of 2, 9-dmph on the copper working electrode;2. production of Cu (I) (2, 9-dmph)2 complex on the electrode; and3. transference of the Cu(I)-complex to the plating solution.As a result, 2, 9-dmph prevented the active alcoholate ion from being adsorbed on the working electrode. Since the characteristic wave disappeared, polarization characteristics were explicable by the mixed potential theory, and copper complex ion Cu (II)Y2- was directly reduced to metallic copper. The surface of the deposit was uniform and the grains were linked. The cross section of the deposit was virtually identical to that of metallic copper.In the case of 5, 6-dmph, which had a ferroine functional group, copper complex Cu (I) (5, 6-dmph)2 formed on the electrode failed to transfer to the plating solution, and the mixed potential theory did not hold. The deposit was amorphous. The surface of the deposit was rough and the cross section was spongy.
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