複合ターゲットからの合金スパッタリング
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概要
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Mo-Ti alloy is sputtered from a Mo target on which is placed Ti ribbon. The uniformity of Ti concentration is affected by the target voltage. When the composite target is sputtered at 300 volts, alloy film deposits with uniform Ti distribution. But at higher target voltage over 1000 volts, the sputtered film has a maximum Ti content at the place just opposite to a Ti ribbon. The alloy films deposited on the substrate heated at 420°C have a body centered cubic structure, and the lattice parameter calculated from (110) X-ray diffraction angle are about 1% larger than bulk alloy. Compared with Mo and Ti, the alloy films have stronger chemical resistance. They are not dissolved by hydrochloric acid and hydrofluoric acid, and more slowly dissolved by nitric acid than Mo.
- 日本真空協会の論文