高真空スパッタと超臨界 CO2 を用いた微細孔の埋め込み
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概要
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Two methods of copper (Cu) filling into through-holes and trenches with various barrier metals were investigated: high-vacuum magnetron sputtering and the supercritical carbon dioxide method. In spite of good Cu-filling by using the supercritical carbon dioxide method, adhesion of the Cu films to the barrier metals worsened with relative resistivity. Examples of Cu-filling by both high-vacuum magnetron sputtering and the supercritical carbon dioxide method for obtaining good adhesion to the barrier metals are shown.
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