Creep-Fatigue Crack Growth in Sn-3.0Ag-0.5Cu Solder

概要

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This paper studies the creep-fatigue crack growth in Sn-3.0Ag-0.5Cu lead-free solder. Strain controlled push-pull low cycle crack growth tests were performed using fast-fast (pp), fast-slow (pc), slow-fast (cp), and slow-slow (cc) strain waveforms at 313K. The fastest crack growth rate was found in the pc waveform, followed by the cp, cc and pp waveforms. Crack growth rates in the pp waveform were well correlated with the cyclic J-integral range and fatigue J-integral range and those in the pc, cp and cc waveforms with the creep J-integral range. No creep-fatigue interaction was found in the correlation of the crack growth rate with the J-integral ranges. The crack grew perpendicular to the specimen axis in the pp waveform. In the cases of the pc, cp and cc waveforms, the crack grew in the perpendicular direction to the specimen axis initially and branched in the direction about 45 degrees to the specimen axis.