Self-Assembly of Fine Particles on Patterned Wettability in Dip Coating and Its Scale Extension with Contact Printing
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This study demonstrates the application of dip coating to self-assembly of fine particles on a substrate that is covered with line-and-space pattern of hydrophilic (SiO_2) and hydrophobic materials (OTS). The pattern was fabricated on a substrate by lithography first. The substrates were drawn up from the water-based suspension in which particles were dispersed and the particles self-assembled on the hydrophilic region only forming the packed-structure. Then, contact printing was applied for the patterning to extend the scale. The scale was extended up to 10mm x 10mm while keeping the self-assemble performance.
- 社団法人 日本機械学会の論文
社団法人 日本機械学会 | 論文
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