Mechanism for Codeposition of Multiwalled Carbon Nanotubes with Copper from Acid Copper Sulfate Bath
スポンサーリンク
概要
- 論文の詳細を見る
The mechanism involved in the codeposition of carbon nanotubes (CNTs) with copper from an acid copper sulfate bath was investigated. Multiwalled carbon nanotubes (MWCNTs) were employed and dispersed using polyacrylic acid. To determine the influence of the fibrous shape of the MWCNTs, codeposition was also carried out using copper and granular carbon black (CB). The effect of the polyacrylic acid on the dispersibility of MWCNTs and CB in the plating baths and the electrodeposition behavior of copper was investigated. In addition, the relationship between the initial MWCNT or CB concentration in the plating bath and that in the composite films was evaluated and the results are discussed based on the two-step adsorption model of Guglielmi. It was found that although for low MWCNT concentrations in the plating bath, this model could adequately explain the codeposition behavior, at higher concentrations, the MWCNT content in the deposit was larger than expected. It is suggested that the increased MWCNT content is related to the fibrous shape of the MWCNTs.
- ELECTROCHEMICAL SOC INCの論文
ELECTROCHEMICAL SOC INC | 論文
- Electrodeposition of Ni-P Alloy-Multiwalled Carbon Nanotube Composite Films
- Low-internal-stress nickel multiwalled carbon nanotube composite electrodeposited from a sulfamate bath
- Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition
- Effects of Additives on Cu-MWCNT Composite Plating Films
- Boron Particle Composite Plating with Ni-B Alloy Matrix