TiO2光触媒で表面改質したABS樹脂上への無電解CuめっきとNi-Pめっき界面のTEM観察
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A new environmentally friendly surface modification method of ABS resin has been investigated using TiO2 as a photo-catalyst and UV irradiation. When the electroless Ni-P films were deposited on the modified ABS resin, the adhesion strength between deposited Ni-P films and resin was two and half times higher than that for electroless Cu films. The reason of this difference was observed by high resolution TEM, and surface and spot EDX analyses. Thickness of mixed layer between deposited Ni-P and resin was apparently thicker than that of the layers between deposited Cu and resin. The deposited electroless Cu films were clearly crystallized at the initial deposition step, even in a modified layer. Therefore, a crystal growth was dominated and a nucleation was hardly occurred at initial deposition of electroless copper film. On the other hand, the deposited electroless Ni-P grain was not observed at the beginning of deposition, and it showed an amorphous like structures. The nucleation was governed and the crystal growth was inferior at the initial deposition of electroless Ni-P film. From composition analyses, the above differences were suggested to be generated by purity of the films. The purity of electroless Cu films was always higher than that of electroless Ni-P films, because the Ni-P films always contained phosphorus generated from reducing agent. In this study, the phosphorus content of the deepest deposited Ni-P films was twice higher than that of bulk Ni-P films and this higher phosphorus contents made it easier to deposit Ni-P at deeper area with low crystallinity. Therefore, an amorphous like structure was prefer for nano-anchor to increase adhesion strength by increasing mixing layer thickness.
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