トリポリリン酸ソ-ダを含む硫酸塩浴からのCu-Zn合金の電析

概要

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Electroplating of Cu-Zn alloys from sulfate solutions containing sodium tripolyphosphate was investigated with a view to clarifying a) the relation between the cathode potential and bath composition, and b) the effect of plating variables on the current efficiency, composition and crystal structure of the deposit, along with the lattice parameter and micro strain of α-Cu in the deposit. Sodium tripolyphosphate brought the deposition potential of copper closer to that of zinc, and the possibility of alloy deposition from tripolyphosphate baths was confirmed. It was found that with increases in current density and Zn concentration in the bath, the current efficiency of deposition of Cu decreased, but that of Zn increased, and the Zn content of the deposit also increased. The lattice parameter and micro strain of α-Cu in the deposit increased with increasing Zn content.
長崎大学工学部の論文