Humidity Control Efficiency of Low-Densit Particleboards for Interior Walls ⅡMeasurement of EMC and calculation of moisture capacities
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概要
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For particleboards made with phenol-formaldehyde(PF) and isocyanate(IC) resins in addition to low-density particleboard (LDPB) and wood-lining board(WLB) used in the previous paper, equilibrium moisture content(EMC)curves at 15,20,and 25℃ were obtained as fundamental data to discuss the differences in bygroscopicity and moisture capacities among them. EMC curves at 20℃were also obtained for the raw material particles and binders, which were used to investigate the decline in hygroscopicity of particles by hot-pressing.The EMCs of PF-bonded boards were approximately 1% higher than those of IC-bonded boards because of the notice able difference in EMCs between the binders. It was found that hygroscopicity of the particles was decreased approximately one-tenth by hot-pressing. For this reason in addition to the presence of binders, the EMCs of PF-and IC-bonded boards were about nine-tenths and eigth-tenths those of the law material particles, respectively. Moisture capacities of LDPB werealmost equal to those of WLB because of the difference in densities of the two products. Moisture capacities of PF-and IC-bonded boards were estimated to be approximately four-fifths of those ofsolid wood with the same density. Humidity dependence of moisture capacities was observed.Values of x, one of the moisture capacities defined in Equation(1), changed on a quadratic curve with its minimum at about 50% relative humidity, whereas values of v, the other one, changed almost linearly with relative humidity.
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