平坦化CMPにおけるパッドドレッシングに関する基礎的研究

概要

論文の詳細を見る
Fundamental investigation for pad conditioning was studied on CMP (Chemical Mechanical Polishing). In particular, pad surface roughness was focused on various pad surface conditions. Pad conditioning under wet condition makes pad surface roughness finer than pad conditioning under dry condition. The pad surface with fine roughness contributes to rapid pad break-in and removal rate　stabilization. In this study, various factors of pad conditioning were verified to clarify the difference of pad conditioning between under wet condition and dry condition. One of major differences of pad conditioning under dry condition against wet condition was the magnitude of friction force between pad and conditioner, which generates stick-slip motion of pad conditioner on a pad. The other was removal efficiency of pad fragment to be scraped away on conditioning pad. Pad fragments disturbs a stable contact between pad and conditioner. Consequently, it will be possible to realize pad pre-conditioning without pasting pad on a platen by taking appropriate measures against the two.
埼玉大学地域共同研究センターの論文