FeSi_2 焼結体と銅板の接合条件の検討

概要

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Solder and soldering condition were examined in order to join the sintered body of FeSi_2 and a copper plate.The solder was placed between the FeSi_2 sintered body and the copper plate, and it was heated at 950〜1000 °C for 3, 10 or 60 minutes in a vacuum of 10^-3 or 1 Pa. The suitable condition was found to be in theNi/Ti/Ni foil case, at 1000 °C for three minutes in a vacuum of 10^-3 Pa. The results of SEM (ScanningElectron Microscope) observation and XRF (X-Ray Fluorescence) analysis suggested that Ti atoms diffusedlargely in the copper plate. A Ni foil was introduced between the Ni/Ti/Ni foil and the copper plate to suppressthe large diffusion of Ti that might deteriorate the electric characteristics, and it was heated at 1000 °C forthree minutes similarly to the previous case. SEM observation confirmed a suitable joint without undesirableTi diffusion.
2012-03-01