C31 ダイヤモンド固定砥粒ワイヤソーの加工事例(OS7 研削・砥粒加工(2))

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概要

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• In late years, sapphire single crystals have been applied in optical flats, windows, filters, covers for electric cells, lenses, as well as substrates for LED. In the production process such as the LED, fixed-abrasive multi-wire saw is often used to get a sapphire wafer efficiency. And in this process, sapphire ingot have been demanded a slicing accuracy. Fixed-abrasive multi-wire sawing process has been classified by using a resinated diamond wire saw or an electroplated diamond wire saw. In this paper, we report the case of slicing sapphire ingot (2inch, 3inch) with electroplated diamond wire, and introduce their high slicing performances.

• 2010-11-19

著者

• 森田 一樹

  アライドダイヤモンド

• 風早 克夫

  アライドダイヤモンド

• 松本 寧

  アライドダイヤモンド

関連論文

• C31 ダイヤモンド固定砥粒ワイヤソーの加工事例(OS7 研削・砥粒加工(2))

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