はんだ接続強度の経時劣化の統計分析

概要

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Mechanical strength of electronic parts grows weaker in accordance with reduction in the size of packaging. In this paper, decreases in tensile strength are evaluated under the condition of a weight hung on a sample. Tensile strength at a solder connecting point is measured in severalpoints of elapsed time under the condition of some weights. It is found that tensile strength decreases with time, even when not weighted condition, and decreasing rate is accelerated by a weight. Each effect of time and weight on decrease in tensile strength is quantitatively separated using statistical analysis. The key factors decreasing the tensile strength are foundto be time for SnPb solder and to be weight for SnAgCu solder, respectively. On the other hand,for SnCuNi solder decrease in strength is small and not dependent on both factors.
サレジオ工業高等専門学校の論文