T1101-1-5 DRIE加工溝側壁の濡れ性を利用した選択的微粒子自己整列(マイクロナノ理工学:nmからmmまでの表面制御とその応用(1))

概要

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Self-assembly of fine particles has an advantage of low cost, high productivity and applicability for three dimensional structures. Surface wettability is dominant factor in this process because the substrate is drawn up from suspension that contains colloidal particles. Wettability can be changed by applying microstructure on the surface and/or chemical modification. On the other hand, when fabricating trench with Deep Reactive Ion Etching (DRIE) on a silicon wafer, microstructures called scallop is formed on the trench sidewall. We demonstrate the self-assembly on the sidewall utilizing the difference of wettability between the sidewall and bottom. It was confirmed that monolayers of polystyrene particles can be produced only on the trench sidewall.
社団法人日本機械学会の論文
2009-09-12