集積回路技術のモデリング : 物理とコンピュータ計算への挑戦

概要

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Technology Computer-Aided Design (TCAD) is described both in terms of its function in Integrated Circuit (IC) design and in terms of the underlying physics and numerical modeling. TCAD provides IC designers with the ability to look inside chip technology and understand complex interdependence of parameters that affect performance and manufacturability. The simulation tools that are used for TCAD involve a close coupling of physical models and advanced numerical algorithms. An example of the interplay of electrical effects at the device level and underlying fabrication process steps is given for the latchup problem. Several examples of process modeling are used to illustrate the intimate connection of physical effects such as oxidation, impurity diffusion and plasma etching with the numerical models. Finally, some of the software engineering and computational issues are outlined. Very exciting challenges in parallel computing and advanced visualization techniques are suggested.
日本応用数理学会の論文
1993-09-16