Intermodulation caused by Surface Mount-Device and Defected Connection

概要

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This paper presents an experimental investigation of the passive intermodulation (PIM) caused by surface-mount device and soldering-connections, where a complete non-contact assessment is made using the standing-wave coaxial-tube method. The examination is carried out from the viewpoint of the connected line-length. As a surface-mount device, we evaluate 47Ω-resisters, 10nH-inductor, and 10pF-capacitors as the first phase of the feasibility study. Defected-soldering connection is also evaluated in this paper. The result shows that normal devices produce small PIM less than -120dBm for 15dBm-excitation, while the defected-soldering connection does over -120dBm in average. It is also shown that the defected chip-device produces quite high PIM greater than -120dBm.
社団法人電子情報通信学会の論文
2008-11-08