垂直統合と垂直非統合のビジネス戦略論(2025年半導体デバイスの進化予測,デザインガイア2008-VLSI設計の新しい大地)

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The purpose of this article is to explore the relations between enterprise adaptations to industry characteristics and industry growth in semiconductor industry. The technology progress has been causing the semiconductor industry more capital dependent and technology intensive, while the chip price has been dropping continuously. Emerging enterprises were taking "down-sizing" and "concentration" strategies to join the industry based on new business models and new technologies, to deal with the feature of the semiconductor industry. Accordingly, the semiconductor industry structure has been changing its structure continuously since the 1980's. However, the structure of each semiconductor industry country was different. In the common product field, USA, Taiwan, Japan, and Korea, all these major countries took vertically integrated production system. However, in the non-common product field, Japan took vertically integrated production system which was different from the strategy of other countries. In Taiwan, the fabrication-less companies (fab-less) focused on one item production, so they could manage all the design specifications by themselves. However, Japanese IDM companies produced diversitive productions, so they had to outsource the design houses. Two factors influenced the competitive powers of the (fab-less) and IDM. The first was technology development and investment of foundry. The second was the inter-firm relationships in design stage. The foundry was more and more competitive in investment and technology, and the inter-firm relationship of contract design houses of IDM were losing their competitive ability. These two reasons suggested a fear that the potential of Japanese IDM competitiveness decreased continuously.
2008-11-11

垂直統合と垂直非統合のビジネス戦略論(2025年半導体デバイスの進化予測,デザインガイア2008-VLSI設計の新しい大地)

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