1911 プリント基板内部の熱伝導-1 : 総論とJEDEC基板における熱伝導(J16-1 電子情報機器,電子デバイスの熱制御と強度・信頼性評価(1),J16 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

論文の詳細を見る
Addressed in the present study is the required accuracy in assuming equivalent thermal conductivities of printed circuit boards (PCBs) in the thermal analysis of electronic equipment. Out of various PCB morphologies two are considered as representatives in the extreme ends of PCB size and thermal conditions; one is a JEDEC test board having a large convection-cooled area, and the other is a small board in contact with a large solid thermal mass. The major focus of the present paper is on the case of a JEDEC test board carrying a ball grid array package. In exploring modeling strategies the analyses were performed on three models having different geometric resolution levels. Comparison of the results on the three models proves that the accuracy of temperature prediction is in general insensitive to the equivalent thermal conductivity values due to the dominant role of surface heat transfer on the temperature level of PCB.
社団法人日本機械学会の論文
2007-09-07