Planar Laser-Induced Fluorescence of Fluorocarbon Radicals in Oxide Etch Process Plasma
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概要
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Planar laser-induced fluorescence (PLIF) has been employed to clarify the two-dimensional distribution of CF_2 radicals in an inductively coupled plasma (ICP). Axial profiles and contour plots for CF_2 radical density were monitored for CF_4 (100%), CF_4/Ar (= 10%/90%) and C_4F_8/Ar (= 10%/90%) plasmas in order to examine the roles of electron impact, fluorocarbon film deposition and ion bombardment in the production and loss mechanisms of CF_2 radicals. Concave distributions which were minimal around the bulk plasma were observed for the CF_4/Ar and C_4F_8/Ar plasmas with high electron density, demonstrating that the dominant mechanism is destruction in the bulk plasma by electron impact, rather than production on the surfaces of the substrate and chamber wall exposed to ion bombardment. Substrate biasing resulted not in the enhancement of the surface production but rather in the decrease of the CF_2 density, associated with the fluorocarbon film thickness reduction due to the sputtering effect of ion bombardment. [DOI: 10.1143/JJAP.41.2207]
- 社団法人応用物理学会の論文
- 2002-04-15
著者
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Hayashi Shigenori
Association Of Super-advanced Electronics Technologies (aset):(present)ulsi Process Technology Devel
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SEKINE Makoto
Association of Super-Advanced Electronics Technologies (ASET)
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Ishikawa K
Association Of Super-advanced Electronics Technologies (aset)
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ISHIKAWA Kenji
Association of Super-Advanced Electronics Technologies (ASET)
関連論文
- CF and CF_2 Radical Densities in 13.56-MHz CHF_3/Ar Inductively Coupled Plasma(Nuclear Science, Plasmas, and Electric Discharges)
- Realistic Etch Yield of Fluorocarbon ions in SiO_2 Etch Process
- Planar Laser-Induced Fluorescence of Fluorocarbon Radicals in Oxide Etch Process Plasma
- Realistic Etch Yield of Fluorocarbon Ions in SiO2 Etch Process