電子デバイスはんだ接合部の熱サイクル加速信頼性試験方法

概要

論文の詳細を見る
Thermal cycle tests for solder joints of electronic devices are generally performed to investigate their reliability under field service (design) conditions. It is important to clear a relationship between an accelerated test condition and a service condition and to determine a practical accelerated test condition. The relationship between an accelerated test condition and a service condition is explained by use of the solder joint fatigue curve. An accelerated reliability test condition is shown taking account of several factors such as a number of test samples, strain ranges of solder joints under accelerated test temperatures conditions, standard variations of fatigue life of solder joints, reliability and confidence level of devices under service conditions. Moreover, the cases that the standard deviation of fatigue life is known or unknown are investigated. A specific analytical and experimental result for single outline packages is shown.
社団法人日本材料学会の論文
2004-02-15