Study of Return Loss for a Test Board with Bonding Wires by FDTD Method

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概要

• 論文の詳細を見る

• Return losses of bonding wires fabricated on a test board for RF and microwave circuit applications are studied by the finite-difference time-domain (FDTD) msthods. Simulation results of return losses obtained by the FDTD method arepresented and compared with those obtained by the HFSS software and meaasurements at frequencies of 0.04〜6 GHz. It is found that simulation results calculated by the FDTD method make a good agreement with those obtained by the HFSS software. Results of the FDTD method are also further validated by the measurement data.

• 社団法人電子情報通信学会の論文
• 2007-03-01

著者

• Su Chieh-pin

  Department Of Communications Engineering Yuan Ze University

• Chen Hsing-yi

  Department Of Communications Engineering Yuan Ze University

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