20701 機械工学が支援する最先端電子デバイス(機械工学が支援する半導体製造技術(I),OS13 機械工学が支援する半導体薄膜製造技術)
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概要
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Current electronic devices consist of extremely small elements, such as ultra-small transistors with gate length of 65nm. Although the development and fablication of these advanced dvices have been primarily based upon electronics, also other science and technology are essential and playing as supporting roles. In this paper, we describe how important mechanical issues have been in this field, such as mechanical strength of 300mm silicon wafers, the impact of wafer geometry on CMP (Chemical Mechanical Polishing), and stress-imposed transistors to improve electron and hole mobilities.The more reduced size of devices are required, the more important mechanical engineering becomes.
- 社団法人日本機械学会の論文
- 2005-03-17
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関連論文
- CMPにおけるウェーハエッジロールオフの影響(機械要素,潤滑,工作,生産管理など)
- 酸窒化技術を使った高性能・高信頼の Deep Sub-micron CMOS-FET
- 20701 機械工学が支援する最先端電子デバイス(機械工学が支援する半導体製造技術(I),OS13 機械工学が支援する半導体薄膜製造技術)