Monitoring for Ultra-Precision Cutting Process of Single Crystal Silicon

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概要

• 論文の詳細を見る

• It is well known that brittle materials such as glasses, silicon and so on, can be machined ductile mode cutting like soft metals when the depth of cut is less than critical depth. Face turning using R shaped tool were carried out two types of cutting method (Extreme low feed cutting and Extreme small depth cutting) to distinguish brittle mode from ductile mode by AE signal and cutting forces. Perfectly mirrored surface with roughness (PV) of several tens nanometers can be obtained when maximum undeformed chip thickness was thin in extreme low feed cutting. RMS value of AE signal was larger and cutting force ratio (Thrust/Principal force) was lower when PV of machined surface was larger.

• 一般社団法人日本機械学会の論文
• 2005-10-18

著者

• KONDO Eiji

  Kagoshima University

• KAWAGOISHI Norio

  Kagoshima University

• IWAMOTO Ryuichi

  Kagoshima Prefecture Institute of Industrial Technology

• OKUBO Noriyuki

  Kagoshima University

• ICHIKI Koichi

  Kagoshima Prefecture Institute of Industrial Technology

関連論文

• Improvement of Cutting Tool's Life by Multilayering Structure of Tool Materials(Advanced machining technology (continued))
• Monitoring for Ultra-Precision Cutting Process of Single Crystal Silicon
• Monitoring of Machining Error Caused by Deflection of Small Diameter End-Mill using Measured Cutting Forces

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