3D Field Simulation of Magnetic Thin Film Inductor

スポンサーリンク

概要

• 論文の詳細を見る

• The 3D magnetic field simulations with FEM (finite element method) have been performed to predictand understand the performance of Magnetic Thin Film Inductor (MTFl). Inductor structures of planar electroplated Cu spiralcoil, which are sandwiched and underlaid with magnetic thin films, are considered as the simulation models. The inductance increment of 300% compared to air-core inductor was predicted when the sandwiched 5μm thickness magnetic thin film with relative permeability of 600 was adopted. Impedance measurement for the fabricated MTFI showed a good agreement with the simulation result. We also found that the undesirable increment of resistance at high frequency was originated from the eddy current flow through magnetic thin film.

• 秋田大学の論文

著者

• Sato Shigeki

  Tdk Corporation

• FUJIWARA Toshiyasu

  TDK Corporation

• CHOI Kyung-Ku

  TDK Corporation

関連論文

• 3D Field Simulation of Magnetic Thin Film Inductor

スポンサーリンク