マイカ砥粒によるシリコンウェハのポリシング特性

概要

論文の詳細を見る
Today, Opto-mechatronics parts have become highly functionalised and downsized. As such, the polishing method, which is employed in the last stage of machining process, has grown its significance. The present investigation dealt with mica, being newly used as abrasive. The abrasive was used as mica slurry and a granulated mica polishing disc. By polishing the silicon wafer of 4-inches in diameter with this slurry, the following was found : (1) When using the mica slurry (LC10 and NCA10), the surface roughness of the silicon wafer became a mirror surface of less than 5 nmRa in 30-minutes polishing time. (2) The surface roughness, when using the mica polishing disc, became 5, nmRa, which was the same degree as the slurry of the commercial item did.
八戸工業高等専門学校の論文
2004-12-20