ワイヤボンダXYテーブルの低振動化(マイクロメカトロニクス,IIP2004 情報・知能・精密機器部門講演会)

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概要

• 論文の詳細を見る

• Over the past few decades, rapid strides have been made in high speed and high precision wire bonding, which is one of semi-conductor assembling processes. The high speed and precision are mainly realized by XY-table and bonding head of wire bonder. Especially XY-table requires low vibration after high speed positioning. This paper reports that our accomplishment in developing the low vibration AY-table, which consists of liner motor and has the structure of high natural frequency.

• 一般社団法人日本機械学会の論文
• 2004-03-22

著者

• 大石 純一郎

  Nec

関連論文

• ワイヤボンダXYテーブルの低振動化(マイクロメカトロニクス,IIP2004 情報・知能・精密機器部門講演会)

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