Deposition of Phosphorus Doped Silicon Films by Thermal Decomposition of Disilane
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概要
- 論文の詳細を見る
Phosphorus doped silicon films are deposited in the temperature range 520-665℃ by thermal decomposition of Si_2H_6. It is found that (i) the deposition rate is not decreased by the addition of PH_3 in contrast with the deposition rate for the SiH_4 system and is about 100 times higher than that for the SiH_4 system for phosphorus concentration above 1×10^<20> cm^<-3>, (ii) phosphorus concentration is proportional to the PH_3 partial pressure and to the -3/2 power of Si_2H_6 partial pressure. These characteristics mean that Si_2H_6 is suitable as a source gas to prepare the heavily phosphorus doped polycrystalline silicon for fabricating gate or emitter electrodes of LSI's.
- 社団法人応用物理学会の論文
- 1984-07-20
著者
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Yonezawa H
Ntt Interdisciplinary Research Laboratory
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Yonezawa Hiroki
Ibaraki Electrical Communication Laboratories Nippon Telegraph And Telephone Corporation
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Yonezawa Hiroki
Ibaraki Electrical Communication Laboratory Nippon Telegraph And Telephone Public Corporation
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Murota Junichi
Atsugi Electrical Communication Laboratory Nippon Telegraph And Telephone Public Corporation
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NAKAYAMA Satoshi
Atsugi Electrical Communication Laboratory, Nippon Telegraph and Telephone Public Corporation
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Nakayama Satoshi
Atsugi Electrical Communication Laboratory Nippon Telegraph And Telephone Public Corporation
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- Deposition of Phosphorus Doped Silicon Films by Thermal Decomposition of Disilane
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