Interfacial Properties of Silicon Structures Fabricated by Vacuum Grooved Surface Bonding Technology
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概要
- 論文の詳細を見る
The paper presents a novel modification of a direct bonding technology. A presented innovation is aimed at fabricating void free interfaces with a low defect density. For this purpose the bonding boundaries are manufactured as grooved, and the bonding annealing is performed under vacuum conditions. It has been found that the grooves act as dislocation traps. A trapped gas escapes through the grooves which facilitates the void removal. By X-ray and electron diffraction techniques the grooves have been observed to flatten rapidly. The electrical properties of the grooved interfaces are as good as those of diffusion p-n junctions.
- 社団法人応用物理学会の論文
- 1998-12-15
著者
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Hartwig Jurgen
European Synchrotron Radiation Facility
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Kim Sang-cheol
Power Semiconductor Research Laboratory Korea Electrotechnology Research Institute
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ARGUNOVA Tatyana
Ioffe Physico-Technical Institute
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GREKHOV Igor
Ioffe Physico-Technical Institute
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KOSTINA Lyudmila
Ioffe Physico-Technical Institute
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KUDRYAVTZEVA Tina
Ioffe Physico-Technical Institute
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GUTKIN Mikhail
Institute of Mashine Science Problems, Russian Academy of Sciences
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KIM Eun-Dong
Power Semiconductor Research Laboratory, Korea Electrotechnology Research Institute
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KIM Nam-Kyun
Power Semiconductor Research Laboratory, Korea Electrotechnology Research Institute
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Kim Nam-kyun
Power Semiconductor Research Laboratory Korea Electrotechnology Research Institute
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Kim Eun-dong
Power Semiconductor Research Laboratory Korea Electrotechnology Research Institute
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Gutkin Mikhail
Institute Of Mashine Science Problems Russian Academy Of Sciences
関連論文
- Interfacial Properties of Silicon Structures Fabricated by Vacuum Grooved Surface Bonding Technology
- In Situ Synchrotron X-ray Characterization of Microstructure Formation in Solidification Processing of Al-based Metallic Alloys