Melting CuO in BaTiO_3-based System
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概要
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A liquid phase formed from the melt of CuO has been demonstrated to appear at temperatures lower than 900℃ in the BaTi_<1.01>O_<3.02> system. Differential thermal analysis (DTA) and thermogravimetric (TGA) for BaTi_<1.01>O_<3.02> with 1 wt% CuO added reveal an endothermic peak, starting at about 900℃ and accompamied by a weight loss of about 0.12 wt%. The more CuO is added into BaTi_<1.01>O_<3.02>, the lower the temperature ranges of endothermic peaks and the more the weight loss will be. BaTi_<1.01>O_<3.02> with CuO added can be densified at a temperature lower than 1100℃. The DTA and TGA curves for pure BaTiO_3 with only CuO or with CuO and TiO_2 each exhibit a shallow endothermic peak. These endothermic peaks begin at about 990℃ and finish at about 1030℃, accompanied by an insignificant weight loss. CuO can also improve the densification of both pure BaTiO_3 and pure BaTiO_3 with TiO_2 added at a temperature lower than 1250℃.
- 社団法人応用物理学会の論文
- 1996-10-15
著者
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Yang Cheng-fu
Department Of Chemical And Materials Engineering National University Of Kaohsiung
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Yang Cheng-fu
Department Of Electronic Engineering Chinese Air Force Academy
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