Reaction-Bonded Boron Nitride-Aluminum Nitride Ceramic Composites
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概要
- 論文の詳細を見る
Hexagonal boron nitride-aluminum nitride (h-BN-AlN, 75-25 wt%) ceramic composites are synthesized by reaction bonding. Metallic component-free, relatively dense composites are obtained by using h-BN and Al as starting materials and by optimizing sintering conditions. In comparison with reaction-bonded BN, higher bending strength, 98 MPa, and higher thermal conductivity, 66 W/(m・K), are attained for a Y_2O_3-added BN-AlN composite. A low thermal expansion coefficient of 2.6×10^<-6>/K is also achieved.
- 社団法人応用物理学会の論文
- 1991-06-15
著者
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Kubo H
Department Of Electronic Engineering Faculty Of Engineering Osaka University
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Kanai T
Advanced Materials & Technology Research Laboratories Nippon Steel Corporation
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TANEMOTO Kei
R&D Laboratories-I, Nippon Steel Corporation
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Tanemoto K
Advanced Materials & Technology Research Laboratories Nippon Steel Corporation
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KANAI Takao
R&D Laboratories-I, Nippon Steel Corporation
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KUBO Hiroshi
R&D Laboratories-I, Nippon Steel Corporation
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