Reliable Au Wire Bonding to Al/Ti/Al Pad

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 1993-05-15

著者

• Ueno H

  Himeji Inst. Technol. Himeji Jpn

• Ueno H

  Department Of Electrical Engineering Faculty Of Engineering Himeji Of Technology

• UENO Hiroshi

  Semiconductor Research Laboratory, Clarion Co., Ltd.

• Ueno Hiroshi

  Semiconductor Research Laboratory Clarion Co. Lid.

関連論文

• HOST RANGE EXPANSION OF THE PHYTOPHAGOUS LADYBIRD BEETLE, EPILACHNA VIGINTIOCTOPUNCTA TA IN SOUTHEAST ASIA(Taxonomy and Systematics,Abstracts of papers presented at the 74^ Annual Meeting of the Zoological Society of Japan)
• Photoluminescence Quenching in Polysilanes by Fullerene Doping and Effective Photoinduced Charge Transfer Depending on Aromatic Side Group
• Electroluminescent Diodes Utilizing Polysilanes
• Study on Surface Acoustic Wave Devices for a Pulse Position Modulated Direct Sequence Spread Spectrum Communication System
• Surface Acoustic Wave Multiple Phase Shift Keying Modulator-Demodulator Circuits
• Influence of Creeping Distance and Gas Pressure on Negative Creeping Dischargefor Composite Insulation Consisting of N_2/SF_6 and Solid Dielectric under Pulse Voltage
• Negative Creeping Discharge Characteristics of a Gas/Solid Composite Insulation System under Pulse Voltages
• Residuals Caused by the CF_4 Gas Plasma Etching Process
• Reliable Au Wire Bonding to Al/Ti/Al Pad
• HOST RACES OF HENOSEPILACHNA SP. 3 : I. GEOGRAPHIC DISTRIBUTION AND HOST PLANT SPECIFICITY IN JAVA, INDONESIA(Taxonomy and Systematics,Abstracts of papers presented at the 76^ Annual Meeting of the Zoological Society of Japan)
• Preliminary Experiments on Adult Food Preference of the Indonesian Phytophagous Ladybird Beetle, Epilachna sp. aff. emarginata (Coleoptera : Coccinellidae)
• Au Wire Bonding to Cu Pad Using Ti Thin Film

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