低熱膨張金属を中間層に用いたAlNとCuの接合 : 窒化アルミニウムと金属の接合に関する研究(第3報)

概要

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The influence of the low expansivity interlayer on the cracking susceptibility and properties of AlN-copper joints brazed with Ag-Cu-Ti filler metal was examined. The thermal stress and heat conduction numerical analyses suggest that not only crack-free joints but also the superior thermal conductive joints can be produced by employing tungsten or molybdenum interlayer for AlN to copper joining. The cracking of AlN-OFC joints can be prevented by increasing the tungsten and molybdenum interlayer thicknesses above 0.8 mm and 2.0 mm, respectively. The tensile strength of AlN-OFC joints brazed at 1078 K for 120 s with 1.0 mm thick tungsten interlayer is approx. 50 MPa. AlN-W-OFC joints using Ag-Cu-Ti filler metal indicate the superior reliability for thermal fatigue and heat conduction.
1994-08-05