溶融ポリエチレンのぬれと接着性について

概要

論文の詳細を見る
The kinetics of wetting and adhesion of adherends (base materials) by molten polyethylene in argon gas were investigated. The former were followed by the rate of change of cosin of contact angle and the latter by the increase in peel strength according to heating time. A summary on the results is shown below : (1) It is confirmed that the dependence of wetting of glass, copper and teflon on time and temperature follows a law of time-temperature reduction and the master curves obtained on these adherends almost coincide with eachother. (2) Wettability is closely related to adhesiveness but the rate of adhesion is considerably greater than the rate of wetting. (3) The wettability and adhesiveness of copper adherend are respectably inferior to those of glass adherend, in consideration of the wettability by molten polyethylene and surface energy of both adherends. This is explained by the assumption that the numbers of bonds between polyethylene and adherend on unit interface are smaller in the case of copper than glass.
社団法人溶接学会の論文
1976-03-05