100-GHz Ultra-Broadband Distributed Amplifier in Chip-Size Package(Microwaves, Millimeter-Waves)
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概要
- 論文の詳細を見る
We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines and the amplifier has a bandwidth of beyond 110 GHz. The transmission line on the substrate consists of grounded coplanar waveguides that yield low insertion loss and high isolation characteristics in coupled lines even in mold resin in comparison with conventional microstrip lines. The CSP amplifier achieved a gain of 7.8 dB, a 3-dB bandwidth of 97 GHz, and operated up to 100 GHz. To the best of our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP. We also investigated the transmission characteristics of lead-free solder bumps through experiments by assemblying CSPs on printed circuit boards and modeling them so that we could design the packages accurately.
- 2004-07-01
著者
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KOBAYASHI Kazuhiko
FUJITSU LABORATORIES LTD.
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Masuda S
Fujitsu Laboratories Ltd.
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JOSHIN Kazukiyo
Fujitsu Laboratories Ltd.
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MASUDA Satoshi
Fujitsu Laboratories Ltd.
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KIRA Hidehiko
Fujitsu Ltd.
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KITAJIMA Masayuki
Fujitsu Ltd.
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