Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems

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概要

• 論文の詳細を見る

• The small planar packaging (SPP) system described here can be combined with card-on board (COB) packaging in high-speed asynchronous transfer mode (ATM) switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density, high packaging density and high cooling capability. Prototype SPP system with air flow control structure for switching MCMs is constructed. Each MCM contained a 3×5 array of low thermal resistance butt-lead pin-grid-array on a glass ceramic substrate measuring 100×170mm with a plate fin heat-sink. This allows a power dissipation of more than 125W per MCM, and 300W per printed circuit board (PCB). Obtained board level heat flux density of the SPP system is 0.37W/cm^2, which is six times that of conventional COB packaging. The SPP system combined with the COB packaging provides a small system foot-print and compact hardware for high-speed, large capacity ATM switching systems. This high-performance air cooling technology will be especially useful for future broadband ISDN high-speed switching systems.

• 社団法人電子情報通信学会の論文
• 1998-10-25

著者

• Kishimoto Tohru

  NTT Network Service Systems Laboratories

• Kishimoto Tohru

  Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

• KANEKO Yasuo

  NTT Network Service Systems Labs., Ntt ATM Backbone Network Systems Project

• Kaneko Yasuo

  Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

関連論文

• Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules
• Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems

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