SOI/CMOS Circuit Design for High-Speed Communication LSIs (Special Issue on New Concept Device and Novel Architecture LSIs)
スポンサーリンク
概要
- 論文の詳細を見る
This paper discusses the features of SOI/CMOS circuits in comparison with bulk/CM0S circuits. We have to design circuits with small fan outs and short wires to take advantage of high-speed and low-power SOI/CMOS devices to their fullest. We can take advantage of the SOI/CMOS structure if the ratio of the source/drain capacitances to the gate capacitances is much greater in the load capacitance. Thus, we propose a new flip-flop circuit with a smaller gate capacitance. The flip-flop circuit operates 30% faster than the previous circuit at 2.0 V. We also propose a buffer circuit having less delay disparity between the complementary output signals. The buffer circuit has the delay disparity of 18 ps at 0.2 pF and 2.0 V. We fabricated an 8-bit frequency divider and a 4-bit demultiplexer using the proposed circuits and 0.35 μm SOI/CMOS process. The 8-bit frequency divider and the 4-bit demultiplexer operate at 2.8 GHz and 1.6 GHz, respectively, at 2.0 V.
- 社団法人電子情報通信学会の論文
- 1997-07-25
著者
-
MAEDA Shigenobu
ULSI Development Center, Mitsubishi Electric Corporation
-
Ueda K
Mitsubishi Electric Corp. Itami‐shi Jpn
-
Ueda Kimio
System Lsi Development Center Mitsubishi Electric Corp.
-
Wada Yoshiki
System Lsi Development Center Mitsubishi Electric Corp.
-
Wada Y
Advanced Technology R&d Center Mitsubishi Electric Corporation
-
Maegawa Shigeto
Advanced Device Development Dept. Renesas Technology Corp.
-
Ueda K
System Lsi Laboratory Mitsubishi Electric Corporation
-
Ueda Kimio
Lsi Laboratory Mitsubishi Electric Corporation
-
Maeda Shigenobu
Ulsi Development Center Mitsubishi Electric Corporation
-
Mashiko Koichiro
The Ulsi Development Center Mitsubishi Electric Corporation
-
Mashiko Koichiro
System Lsi Development Center Mitsubishi Electric Corporation
-
Mashiko Koichiro
System Lsi Laboratory Mitsubishi Electric Corporation
-
Ueda K
Ntt Atsugi‐shi Jpn
-
HIROTA Takanori
the System LSI Division, Mitsubishi Electric Corp.
-
WADA Yoshiki
LSI Laboratory, Mitsubishi Electric Corporation
-
HIROTA Takanori
LSI Laboratory, Mitsubishi Electric Corporation
-
MASHIKO Koichiro
LSI Laboratory, Mitsubishi Electric Corporation
-
HAMANO Hisanori
LSI Laboratory, Mitsubishi Electric Corporation
-
Ueda Katsuhiko
Department Of Information Engineering Nara National College Of Technology
-
Hamano H
Mitsubishi Electric Corp. Itami‐shi Jpn
関連論文
- Hysteretic Josephson Junction Behavior of Ba_K_xBiO_3 Grain Boundary Junctions Using SrTiO_3 Bicrystal Substrates
- Partially Depleted SOI Technology with Body-Tied Hybrid Trench Isolation for High-Speed System-On-a-Chip Application(Special Issue on Integrated Systems with New Concepts)
- Direct Measurement of Transient Drain Currents in Partially-Depleted SOI N-Channel MOSFETs Using a Nuclear Microprobe for Highly Reliable Device Designs
- A Sub 1-V L-Band Low Noise Amplifier SOI CMOS(Special Section on Analog Circuit Techniques and Related Topics)
- A CAD-Compatible SOI-CMOS Gate Array Using 0.35 μm Partially-Depleted Transistors (Special Issue on Low-Power High-Speed CMOS LSI Technologies)
- Analyses of the Radiation-Caused Characteristics Change in SOI MOSFETs Using Field Shield Isolation
- The Influence of the Buried Oxide Defects on the Gate Oxide Reliability and Drain Leakage Currents of the Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistors
- Analysis of the Delay Distributions of 0.5μm SOI LSIs (Special Issue on SOI Devices and Their Process Technologies)
- High-Speed SOI 1/8 Frequency Divider Using Field-Shield Body-Fixed Structure
- Suppression of Self-Heating in Hybrid Trench Isolated SOI MOSFETs with Poly-Si plug and W plug
- Impact of μA-ON-Current Gate-All-Around TFT (GAT) for Static RAM of 16Mb and beyond
- Impact of μ A-ON-Current Gate All-Around TFT (GAT) for 16MSRAM and Beyond
- A Design of High-Speed 4-2 Compressor for Fast Multiplier (Special Issue on Ultra-High-Speed LSIs)
- A Floating-Point Divider Using Redundant Binary Circuits and an Asynchronous Clock Scheme
- A 286 MHz 64-b Floating Point Multiplier with Enhanced CG Operation
- A 2.6-ns 64-b Fast and Small CMOS Adder (Special Issue on Ultra-High-Speed LSIs)
- A Study on Semi-Blind Adaptive equalizer for PSK and QPSK Signals
- Impact of Body Bias Controlling in Partially Depleted SOI Devices with Hybrid Trench Isolation Technology
- A 90nm-node SOI Technology for RF Applications
- A Missense Mutation in Tomato mosaic virus L_A-Fukushima Genome Determines Its Symptomless Systemic Infection of Tomato
- Discrimination between Virulent and Attenuated Isolates of Tomato mosaic virus by Restriction Fragment Length Polymorphism
- Blind Adaptive Equalizer Based on CMA and LMS Algorithm(Fundamental Theories)
- Ultra Low Power Operation of Partially-Depleted SOI/CMOS Integrated Circuits (Special Issue on Low-power LSIs and Technologies)
- SOI/CMOS Circuit Design for High-Speed Communication LSIs (Special Issue on New Concept Device and Novel Architecture LSIs)
- An 80-MOPS-Peak High-Speed and Low-Power-Consumption 16-b Digital Signal Processor
- A 16-bit Digital Signal Processor with Specially Arranged Multiply-Accumulator for Low Power Consumption
- 3.0 Gb/s, 272 mW, 8:1 Multiplexer and 4.1 Gb/s, 388 mW, 1:8 Demultiplexer
- A New Emitter-Follower Circuit for High-Speed and Low-Power ECL
- Improvement of Surface Morphology of Epitaxial Silicon Film for Elevated Source/Drain Ultrathin Silicon-on-Insulator Complementary-Metal-Oxide-Semiconductor Devices
- Aiming for SIS Mixers Using Ba_<1-x>K_xBiO_3 Bicrystal Junctions (Special Issue on Basic Properties and Applications of Superconductive Electron Devices)
- Fabrication Of Full Hign-T_c Superconducting YBa_2Cu_3O Trilayer Junctions Using a Polishing Technique
- YBaCuO/PrBaCuO/YBaCuO Trilayer Junctions on Vicinal Substrates : Superconductors
- Improvement in Ba_K_xBiO_3 Grain Boundary Junctions by Ar^+ Beam Irradiation
- Significant Improvement in Ba_K_xBiO_3 Grain Boundary Junctions on MgO Bicrystal Substrates by Minimal BaBiO_3 Sputtering
- A 0.4 μm Gate-All-Around TFT (GAT) Using a Dummy Nitride Pattern for High-Density Memories
- Hot Carrier Evaluation of TFT by Emission Microscopy (Special Issue on Quarter Micron Si Device and Process Technologies)
- Improvement of Surface Morphology of Epitaxial Silicon Film for Elevated Source/Drain Ultrathin Silicon-on-Insulator Complementary-Metal-Oxide-Semiconductor Devices
- Automatic Seal Imprint Verification System with Imprint Quality Assessment Function and Its Performance Evaluation
- High-Speed SOI 1/8 Frequency Divider Using Field-Shield Body-Fixed Structure