Cu下地層上にスパッタしたCo-Pt合金膜の結晶構造と垂直磁気異方性

概要

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Cu underlayers were sputtered on mica and glass substrates at substrate temperatures T^<Cu>_s ranging from 20 to 300℃. Then, at a substrate temperature of 100℃, Co_<75>Pt_<25> alloy layers were sputtered on them. The (111)-orientation of Cu underlayers on mica substrates was dramatically improved by elevating T^<Cu>_s above 200℃, while the Cu underlayers on glass substrates were hardly textured even at 300℃. Co-Pt alloy layers on highly (111)-oriented Cu underlayers were of (00.1)-oriented hcp structure, though a trace of (111)-oriented fcc phases was detected. In the Co-Pt/Cu/mica films, effective perpendicular anisotropy K_<eff> increased remarkably with rising T^<Cu>_s, in accordance with the development of (00.1)-oriented hcp phase. On the other hand, K_<eff> remained negative even at 300℃ in the Co-Pt/CU/glass films. No significant difference in K_<eff> was found between Co-Pt/Cu/mica and Co-Pt/Pt/mica films. The uniaxial anisotropy constants K_1 and K_2 were evaluated from torque curves. The enhancement of K_<eff> was due solely to the increase in K_1, and K_2 varied only a little with the development of texture.
社団法人日本磁気学会の論文
2001-04-15