427 非定常熱応力下 IC パッケージの応力拡大係数の 3 次元有限要素法解析

概要

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An interface delamination in IC Packages is a critical issue in both structural design and material selection of plastic IC packages. The 3-D finite element analyses were carried out to examine the stress-intensity factor of delamination interface in IC packages subjected to steady and non-steady thermal stresses. The stress-intensity factor K associated with a thermal interface crack was evaluated by the modified crack closure integral. The conditions of thermal stress, which were steady and non-steady thermal stresses, were compared. Especially, it is considered that K_<III> could not be neglected at the corner part in IC Packages. Therefore, the 3-D finite element analysis is indispensable to the estimation of the stress-intensity factors at the corner part in IC packages.
一般社団法人日本機械学会の論文
2000-07-31