H212 THERMAL PERFORMANCE OF A RESONANT COOLING DEVICE FOR CPU IN A PERSONAL COMPUTER(Electronics cooling-3)

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概要

• 論文の詳細を見る

• The present study investigates thermal performance of an innovative resonant cooling device for Pentium 150MHz central processing unit (CPU) in a desktop personal computer. The new resonant cooling method induces an acoustic pressure wave with a resonant forcing frequency to a heat sink that has a specific natural shedding frequency. The external acoustic forcing is produced by a woofer with a predetermined frequency and velocity amplitude generated from a sinusoidal pulse generator and a signal amplifier. The woofer is installed vertically on the outside plate of a desktop personal computer so that low-frequency acoustic pressure wave intrudes normally the top surface of the heat sink for CPU. The experimental results show that when the external forcing frequency is in tune with a specific natural frequency, the surface temperature of the CPU is dramatically reduced without a conventional cooling fan. The reduction in the surface temperature of the CPU is more pronounced for the acoustic excitation of high velocity amplitude.

• 一般社団法人日本機械学会の論文
• 2000-10-01

著者

• Kim Sung

  Flow Control Research Center Korea Institute Of Science And Technology

• Kim Seo

  Thermal

• Kang Byung

  Thermal

関連論文

• H107 INFLUENCE OF THE HYDRAULIC BOUNDARY LAYER ON THE CONVECTIVE HEAT TRANSFER IN POROUS MEDIA(Electronics cooling-2)
• E206 EFFECTS OF HYDROPHILIC SURFACE TREATMENT ON EVAPORATION HEAT TRANSFER AT THE OUTSIDE WALL OF ENHANCED TUBES(Evaporation-1)
• H212 THERMAL PERFORMANCE OF A RESONANT COOLING DEVICE FOR CPU IN A PERSONAL COMPUTER(Electronics cooling-3)
• H211 HEAT TRANSFER FROM AN ALUMINUM FOAM HEAT SINK FOR ELECTRONICS COOLING(Electronics cooling-3)

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