H211 HEAT TRANSFER FROM AN ALUMINUM FOAM HEAT SINK FOR ELECTRONICS COOLING(Electronics cooling-3)

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概要

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• Experiments were carried out to investigate the heat transfer characteristics of aluminum foam heat sink placed on a heat source in a channel. The performance of the aluminum foam heat sink was evaluated by the convective heat transfer coefficient on the heat source, which was calculated by dimensionless surface temperature. At a fixed porosity, ε = 0.92, pore density and Reynolds number Re were varied in the range of the parameters; 10, 20, 40 PPI (Pore Per Inch) and 710 ≤ Re ≤ 2900, respectively. It was found that the convective heat transfer was enhanced by the aluminum foam heat sink with lower pore density due to relatively intensified flow through the foam heat sink. In terms of the Nusselt numbers, the performance of the aluminum foam heat sink overweighs that of the conventional heat sink. The aluminum foam heat sink can also reduce the weight of the cooling device for the electronics

• 一般社団法人日本機械学会の論文
• 2000-10-01

著者

• Kim Seo

  Flow Control Research Center Korea Institute Of Science And Technology

• Kang Byung

  Thermal

• Pack Jin

  Thermal

関連論文

• H107 INFLUENCE OF THE HYDRAULIC BOUNDARY LAYER ON THE CONVECTIVE HEAT TRANSFER IN POROUS MEDIA(Electronics cooling-2)
• E206 EFFECTS OF HYDROPHILIC SURFACE TREATMENT ON EVAPORATION HEAT TRANSFER AT THE OUTSIDE WALL OF ENHANCED TUBES(Evaporation-1)
• H212 THERMAL PERFORMANCE OF A RESONANT COOLING DEVICE FOR CPU IN A PERSONAL COMPUTER(Electronics cooling-3)
• H211 HEAT TRANSFER FROM AN ALUMINUM FOAM HEAT SINK FOR ELECTRONICS COOLING(Electronics cooling-3)

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