TED-AJ03-131 A SOURCE-INTEGRATED MICRO COOLING DEVICE

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概要

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• This paper presents a novel high efficiency micropump/evaporator, based on electrohydrodynamic (EHD) forces for high heat flux electronic cooling applications. The device incorporates a MEMS-based active micro-evaporative surface and temperature sensors into a single package that can be directly attached to the heat source. The pump is designed to supply and maintain an ultra-thin liquid film on a 10 × 15 mm evaporative surface, which was a quartz or sapphire wafer with an array of EHD electrodes having gaps varying between 20 μm and 100 μm. A pumping pressure of up to 250 Pa and a cooling capacity of 25 W/(cm)^2 were obtained at electric field strength of 4 V/μm using one of 3M's thermal fluids (HFE-7100) as the working fluid. The EHD power consumption in this case was only 2.5 mW for the highest heat flux. Electric field simulations were performed using FEMLAB-2D software to understand the effects of electrode geometry on the electric field and on the fluid pumping effect.

• 一般社団法人日本機械学会の論文

著者

• Ohadi M.

  Department of Mechanical Engineering University of Maryland

• Ohadi M.

  Department Of Mechanical Engineering University Of Maryland College Park

• Darabi J.

  Department of Mechanical Engineering University of South Carolina

• Chowdhury S.

  Department of Mechanical Engineering University of Maryland College Park

• Lawler J.

  Advanced Thermal and Environmental Concepts, Inc.

• Lawler J.

  Advanced Thermal And Environmental Concepts Inc.

関連論文

• TED-AJ03-339 EXPERIMENTAL STUDY ON POOL BOILING OF FC-72 IN GRAPHITE FOAMS
• TED-AJ03-131 A SOURCE-INTEGRATED MICRO COOLING DEVICE

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